Check module condition before installation

Modules can be damaged during shipping, unloading, storage, or handling on site. Some damage is visible. Other issues are hidden and may only become clear when the right field test is used.

Incoming goods and site acceptance inspection helps you document module condition before installation. This gives your team evidence before modules are mounted, energized, or handed over to the next project stage.

The goal is simple: confirm whether the modules arrived in acceptable condition, identify damage early, and create a clear record that can support supplier discussions, EPC coordination, warranty review, or replacement planning.

When this inspection helps

  • Modules have arrived on site and need to be checked before installation.

  • Packaging, pallets, or modules show signs of transport or handling damage.

  • You need to document visible damage before modules are mounted.

  • You want to check for hidden cell damage that visual inspection may miss.

  • You need to compare incoming module condition with factory or pre-shipment records, where available.

  • You want to identify whether lost bypass diode risk is present before the modules enter operation.

  • You need evidence by module serial number, pallet, batch, or site location.

How we decide the right scope

The final inspection plan depends on what needs to be confirmed and how the results will be used.

1. What condition are the modules in when they arrive?

If packaging is intact and risk appears low, a defined visual inspection and EL sample may be enough. If packaging is damaged, modules were mishandled, or several visible defects are found, a broader inspection may be needed.

2. What evidence do you need?

A quick internal quality check may need less documentation than a supplier dispute, warranty discussion, or insurance review. If the results may be used in a claim or commercial discussion, the inspection plan should produce clear records: serial numbers, photos, EL images, defect classification, and location or batch references.

3. Are factory or pre-shipment records available?

If factory or pre-shipment EL images are available, incoming EL images can help compare module condition before and after transport. This can support a clearer view of whether damage may have occurred during production, shipment, unloading, storage, or handling.

4. Is hidden electrical risk a concern?

Some risks may not be visible in standard inspection. Lost bypass diode issues can remain hidden until critical shading occurs. If this risk is relevant to the project, LBPD testing can be added to screen for affected strings or modules before installation or operation.

5. How should findings be tracked?

Before testing starts, it helps to agree how findings will be mapped: by serial number, pallet, batch, delivery lot, container, string plan, or site convention.

What we may test

For incoming goods or site acceptance inspection, the right method depends on what needs to be confirmed before installation. Intertek CEA may use visual inspection, EL testing, LBPD testing, or a combination of these methods to document visible damage, hidden cell-level damage, and hidden bypass diode risk.

Method What it helps identify When it is useful
Visual inspection Visible module damage, glass breakage, frame damage, backsheet issues, connector damage, burn marks, discoloration, delamination, packaging damage, and other physical signs of poor handling. Useful as the first-level check when modules arrive on site and visible condition needs to be documented.
EL testing Hidden cell cracks, inactive cell areas, internal module damage, interconnect issues, and other cell-level defects that may not be visible from the outside. Useful when visual inspection is not enough, or when field images need to be compared with factory or pre-shipment EL images.
LBPD testing Lost or defective bypass diode behavior that can remain hidden during routine inspection and may create hotspot risk under shading. Useful when the project needs to screen for hidden electrical defects before installation or before modules enter long-term operation.

The exact method mix depends on module condition at arrival, available factory or pre-shipment records, inspection criteria, delivery lot structure, and how the results will be used.